Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Vishay Siliconix
|
VS-50PF |
164Kb/9P |
Wire version available Revision: 04-Dec-14 |
CLA |
103Kb/3P |
Wire Bondable Thin Film Resistor Arrays 01-Jan-2022 |
RFLW3N |
307Kb/5P |
High Frequency Wire Bondable RF Spiral Inductor |
RFLW5N |
265Kb/5P |
High Frequency Wire Bondable RF Spiral Inductor |
NTCC200E4C90008 |
83Kb/3P |
Leadless NTC Thermistor Die Intended for Wire Bonding 01-Jan-2022 |
NCSERIES |
93Kb/4P |
Thin Film Single Value Chip and Wire Capacitors Revision: 02-May-13 |
NC |
97Kb/4P |
Thin Film Single Value Chip and Wire Capacitors 01-Jan-2022 |
MTT |
101Kb/3P |
Wire Bondable Thin Film Multi-Tap Resistor Arrays |
MTR |
92Kb/3P |
Wire Bondable Thin Film Multi-Tap Resistor Arrays Revision: 18-Apr-13 |
NTCC200E4 |
85Kb/3P |
Leadless NTC Thermistor Die Suitable for Wire Bonding 01-Jan-2022 |
NTCC200E4 |
93Kb/3P |
Leadless NTC Thermistor Die Suitable for Wire Bonding Revision: 13-Oct-15 |
NTCC201E4 |
93Kb/3P |
Enhanced Leadless NTC Thermistor Die Suitable for Wire Bonding 01-Jan-2022 |
NTCC201E4 |
93Kb/3P |
Enhanced Leadless NTC Thermistor Die Suitable for Wire Bonding Revision: 17-Feb-2023 |
MTLP |
74Kb/3P |
Wire Bondable Thin Film Micro-Strip Transmission Line Resistor Arrays Revision: 16-Nov-17 |
RFLW3N |
364Kb/5P |
High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" 01-Jan-2022 |
RFLW5N |
274Kb/5P |
High Frequency Wire Bondable RF Spiral Inductor, 0.050" x 0.050" 01-Jan-2022 |
DS2746 |
278Kb/15P |
Low-Cost 2-Wire Battery Monitor with Ratiometric A/D Inputs REV: 122706 |
EBT156 |
266Kb/4P |
Edgeboard Connectors, Single Readout, Dip Solder, Eyelet and Wire Wrap Termination Revision: 16-Feb-09 |
EBT156 |
183Kb/4P |
Edgeboard Connectors Single Readout, Dip Solder, Eyelet and Wire Wrap™ Termination |
EBT156 |
250Kb/4P |
Edgeboard Connectors, Single Readout, Dip Solder, Eyelet and Wire Wrap™ Termination 01-Jan-2022 |