Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Festo Corporation.
|
HSW-16-AP-SD |
80Kb/2P |
Pick and place machine |
TOKYO SEIMITSU CO., LTD
|
W-GM-6200 |
434Kb/2P |
Wafer Edge Grinding Machine |
Festo Corporation.
|
HSP-12-AP |
97Kb/2P |
Pick and place machine |
HSP-12-AP-SD-WR |
84Kb/2P |
Pick and place machine |
HSP-16-AP-SD-WL |
85Kb/2P |
Pick and place machine |
Sanyo Semicon Device
|
LA2805 |
248Kb/9P |
Telephone Answering Machine Use |
Toshiba Semiconductor
|
TLP181TPRFT |
209Kb/9P |
Office Machine Programmable Controllers |
TT Electronics.
|
DS3021 |
318Kb/2P |
Temperature & Small Machine Controller |
IXYS Corporation
|
CPC1909 |
197Kb/7P |
Machine Insertable, Wave Solderable |
CPC1945G |
103Kb/6P |
Machine Insertable, Wave Solderable |
Maxim Integrated Produc...
|
DS2132A |
231Kb/17P |
Digital Answering Machine Processor 041295 |
Molex Electronics Ltd.
|
0638018900 |
35Kb/1P |
Pneumatic Universal Crimp Machine 12/14/2021 |
Festo Corporation.
|
HSP-12-AP-WL |
99Kb/2P |
Pick and place machine |
HSP-12-AS-SD |
74Kb/2P |
Pick and place machine |
HSW-12-AS-SD |
80Kb/2P |
Pick and place machine |
HSW-16-AP-SD-AW |
82Kb/2P |
Pick and place machine |
HSW-16-AS |
71Kb/2P |
Pick and place machine |
HSW-16-AS-SD |
81Kb/2P |
Pick and place machine |
HSP-16-AP |
97Kb/2P |
Pick and place machine |
HSP-16-AP-WR |
99Kb/2P |
Pick and place machine |