Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd.
|
0784990001 |
310Kb/6P |
Camera Socket for Mobile Phone, SMT, Bottom Contact, 6.5x6.5 Camera Module, with Pick-and-Place Cap |
0784990002 |
310Kb/5P |
Camera Socket for Mobile Phone, Bottom Contact, 6.5x6.5 Camera Module, withoutPick-and-Place Cap, Lead free |
0876151009 |
287Kb/5P |
6.35mm (.250) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??(SSI) MPS Header, Through Hole, Right Angle, 35 Circuits, Long Power Blade Contact |
0876639003 |
302Kb/5P |
6.35mm (.250") Pitch Power (DC), 7.62mm (.300") Pitch Power (AC), 2.54mm (.100")Pitch Signal, EXTreme PowerPlus??Board-to-Board Header, Through Hole, RightAngle, 32 Circuits, Power Alpha 3, Signal 24, Power Beta 5, Long Contact, with Bevel |
0759001301 |
137Kb/3P |
3.50mm (.138") Pitch, MX150??Dual Row Header, Breakaway, Right Angle, 20Circuits, 1.25關m (50關") Nickel (Ni) Overall, 2.50關m (100關") Minimum Select Matte TinSn) Plating on Tail, 0.75關m Minimum Select Gold (Au) Contact Area, 3.05mm (.120") |
0759001281 |
137Kb/3P |
3.50mm (.138") Pitch, MX150??Dual Row Header, Breakaway, Right Angle, 16Circuits, 1.25關m (50關") Nickel (Ni) Overall, 2.50關m (100關") Minimum Select Matte Tin(Sn) Plating on Tail, 0.05關m Minimum Select Gold (Au) Contact Area, 3.05mm (.120") |
0757570232 |
110Kb/3P |
3.50mm (.138") Pitch, MX150??Header, Breakaway, Vertical, 3 Circuits, 1.25關m (50關")Nickel (Ni) Overall, 2.50關m (100關") Minimum Select Matte Tin (Sn) Plating on Tail0.05關m Minimum Select Gold (Au) Contact Area, 11.20mm (.440") Mating Pin |
0759001322 |
137Kb/3P |
3.50mm (.138") Pitch, MX150??Dual Row Header, Breakaway, Right Angle, 2 Circuits1.25關m (50關") Nickel (Ni) Overall, 2.50關m (100關") Minimum Select Matte Tin (Sn)Plating on Tail, 0.75關m Minimum Select Gold (Au) Contact Area, 4.75mm (.187") PC |